Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)

Chengdu Yicheng Integrated Circuit Co., Ltd. China has Released a tender for Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2) in Energy, Power and Electrical. The tender was released on Jun 07, 2024.

Country - China

Summary - Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)

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ET reference number - 82678265

Product classification - Electrical apparatus for switching or protecting electrical circuits

Organization Details:

  Address - China

  Contact details - 565656565

  Tender notice no. - 76454545

  ET Ref Id - 82678265

  Document Type - Tender Notices

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Notice Details and Documents:

Description - Description: Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)local title:: 奕斯伟板级封装系统集成电路项目 - 国际招标公告(2)type_of_procedure: Otherbidding_response_method: Not Available

Et Ref Id - 82678265

Deadline - Jun 28, 2024

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