Country - United Kingdom
Summary - Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Deadline - login to view
ET reference number - 83618734
Product classification - Semiconductors
Address - United Kingdom
Contact details - 565656565
Tender notice no. - 76454545
ET Ref Id - 83618734
Document Type - Tender Notices
Description - Description: NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends
Et Ref Id - 83618734
Deadline - Nov 30, -0001
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